March 19, 2013 Accellera Systems Initiative has announced the completion of the SystemC Analog /Mixed-Signal (AMS) 2.0 extensions, an industry-driven mixed-signal standard for electronic system-level design. Read more

February 21, 2013 Silicon Labs, a leader in high-performance, analog-intensive, mixed-signal ICs, and SIGFOX, the first operator of a cellular network fully dedicated to machine-to-machine and Internet of Things (IoT) communications, have announced a first-of-a-kind collaboration for the emerging IoT market. Read more

February 7, 2013 Cadence Design Systems, Inc. has agreed to acquire Cosmic Circuits Private Limited, a leading provider of analog and mixed signal intellectual property (IP) cores. Read more

February 6, 2013 Toshiba Electronics Europe (TEE) has launched the company's first high-current USB ready Li-ion battery charger IC, which offers one of the industry’s fastest charging currents up to 2.0 A.
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January 29, 2013 Cadence Design Systems, Inc. has introduced Virtuoso Advanced Node, a new set of breakthrough custom/analog capabilities designed specifically for the advanced technology nodes of 20 nm and below. Read more

December 6, 2012 Intersil Corporation has selected Future Electronics to be a strategic global distribution partner to help expand and focus the company’s existing distribution network to support sales of high-performance analog, mixed signal and power management semiconductors. Read more

December 5, 2012 Powervation Ltd has raised a $7 million Series C funding round to fuel business growth and accelerate market adoption of the company’s Intelligent Digital Power platform at cloud and communications infrastructure OEMs. Read more

November 12, 2012 The ESS112 unveiled by European Sensors Systems is a full custom mixed-signal capacitive sensor signal conditioning IC aimed at all kinds of capacitive sensors. Read more

October 16, 2012 TSMC has selected Cadence solutions for the company’s 20-nm design infrastructure. The solutions cover the Virtuoso custom/analog and Encounter RTL-to-signoff platforms. Read more

October 3, 2012 High-temperature semiconductor solutions specialist, Cissoid, has signed a global distribution agreement with Future Electronics which will enable Future to address the growing market of high-temperature and high-reliability electronics with Cissoid products. Read more

September 25, 2012 Tanner EDA has released version 15.23 of its full-flow analog and mixed-signal design suite: HiPer Silicon. Read more

September 5, 2012 Mouser Electronics, Inc., has signed a new worldwide distribution agreement with Integrated Device Technology, Inc. (IDT), a world leader in the design and manufacture of high-performance analog, mixed signal and power management semiconductors. Read more

July 18, 2012 Mouser Electronics, Inc., signs a new worldwide distribution agreement with Intersil Corporation, a world leader in the design and manufacture of high-performance analog, mixed signal and power management semiconductors. Read more

July 3, 2012 Maxim Integrated Products, Inc. has unveiled a collection of 15 analog and mixed-signal peripheral modules which plug directly into any FPGA/CPU expansion port that follows the Digilent Pmod standard. Read more

June 26, 2012 NXP Semiconductors N.V. has introduced a dual magnetic sensor designed for all automotive applications where a mechanical angle needs to be measured. Read more

June 20, 2012 JTAG Technologies has introduced the JT 2149/DAF, a compact, mixed-signal (Digital/Analog/Frequency) measurement module. The JT 2149/DAF is the first unit of its type to offer both digital and analog test access to PCBs via JTAG Technologies’ QuadPod signal conditioning interface. Read more

May 2, 2012 austriamicrosystems' Full Service Foundry business unit is extending its 0.35 µm High-Voltage CMOS fabrication service to offer ESD protection up to 8 kV at 50 V and up to 4 kV at 120 V operating voltage in ICs. Read more

May 1, 2012 Microsemi Corporation has introduced a suite of system and power management design tools for high availability wired and wireless communications infrastructure equipment. Read more

April 5, 2012 NXP Semiconductors N.V. has signed a definitive agreement to acquire the Dutch electronic design and IP company Catena Group which will help NXP to continue to innovate in the automotive analog mixed signal solutions business and in wireless car connectivity. Read more

March 6, 2012 Dialog Semiconductor plc is licensing the ARM Cortex-M0 processor for use in future generations of its power management ICs (PMICs) which Dialog claims is the first time a standard 32-bit processor has been integrated into a mixed signal PMIC. Read more

February 21, 2012 NXP Semiconductors has introduced the NXP mobile app for Windows Phone , enabling faster and easier access to all NXP products and support. NXP is the first semiconductor company to introduce a mobile app containing its entire product catalog for Windows Phone, following the introduction of its popular iPhone and Android apps , which have received an average rating of 4+ stars. Over the last few months, Nokia has started shipping its first Windows Phone smartphones, and many other phone manufacturers are adopting this powerful mobile OS as well. Read more

February 15, 2012 austriamicrosystems business unit Full Service Foundry has introduced a new analog/mixed signal high performance process design kit (HIT-Kit) for its 0.35 µm CMOS, High-Voltage CMOS and SiGe-BiCMOS specialty technologies. Read more

February 3, 2012 X-FAB Silicon Foundries has used Silicon Frontline Technology, Inc’s R3D (Resistive 3D) software for X-FAB’s 0.18 micrometer high-voltage process (XH018), to provide improvements in reliability and efficiency by addressing the high-voltage and driver characteristics of mixed-signal SOC designs. Read more

February 1, 2012 Mouser Electronics, Inc., has signed a global distribution agreement with Monolithic Power Systems (MPS), a leading fabless manufacturer of high-performance analog and mixed-signal semiconductors. Read more

January 24, 2012 Analog and mixed-signal semiconductor vendor Semtech Corp., said Monday (January 23) it entered into a definitive agreement to acquire fellow analog and mixed-signal chip supplier Gennum Corp., in a cash deal worth about $494 million. Read more

January 5, 2012 International Rectifier's IRMCK171 one-time programmable ROM-based monolithic mixed-signal IC for sensorless sinusoidal motor control of appliances now meets the standards of IMQ (Italy) Annex R of IEC 60335-1 Edition 4.2 – Class B software requirements. Read more

December 16, 2011 The Global Semiconductor Alliance (GSA) is releasing its Analog/Mixed-Signal/Radio Frequency (AMS/RF) Process Control Monitoring (PCM) Checklist Version 1.0, which is a tool developed by the GSA AMS/RF Working Group’s PCM/Process Checklist Sub-Working Group. Read more

December 13, 2011 Lattice Semiconductor Corporation has released version 6.2 of its PAC-Designer mixed signal design software, with updated support for Lattice’s Platform Manager, Power Manager II and ispClock devices. Users designing with Platform Manager devices now have more integrated access to the Lattice Diamond 1.4 software design environment, also announced today. Read more

December 7, 2011 Fujitsu Semiconductor Limited is deploying Apache Design, Inc’s Totem software to analyze and optimize all their custom integrated circuit (IC) designs which includes analog, memory, high-speed I/O, PMIC (power management IC) and RF ICs that are used in wide variety of consumer, mobile and communications electronic products. Read more

December 2, 2011 Analog Devices, Inc., (ADI) has entered into a worldwide sales distribution agreement with Richardson RFPD, Inc. The deal will see Richardson RFPD, which is one of the leading distributors of RF and microwave components, support the design-in of ADI’s high-performance RF ICs (integrated circuits) along with the company’s full range of analog, mixed-signal and digital signal-processing products. Read more

October 19, 2011 Arasan Chip Systems, Inc., has introduced the company’s USB 2.0 PHY IP. The USB 2.0 PHY comprises a complete on-chip physical transceiver solution optimized for low power consumption, minimal die area, and high data throughput. Read more

October 6, 2011 austriamicrosystems' Full Service Foundry business unit is to expand its 0.35 µm High-Voltage CMOS technology portfolio. By introducing special inter-metal dioxide (IMD) layers, galvanic isolation is improved to over several hundred volts. Read more

October 6, 2011 Diodes Incorporated has used FineSim SPICE multi-CPU circuit simulation technology to tape out two highly integrated synchronous switching voltage regulators. The AP6502 and AP6503, 340 kHz switching frequency external compensated synchronous DC/DC buck converters, are designed for use in consumer electronics systems such as digital TVs, LCD monitors and set-top boxes, which require ultra-efficient voltage conversion. Read more

October 5, 2011 X-FAB, a foundry group for analog/mixed-signal semiconductor applications, has qualified the Cadence Physical Verification System for the majority of X-FAB’s process technologies. Foundry qualification means that X-FAB has given its stamp of approval for silicon accuracy of the Cadence Physical Verification System across all of its process nodes, and that mixed-signal customers can reap new performance and productivity advantages enabled by its tight integration into the Cadence Virtuoso and Encounter flows. Read more

September 21, 2011 JVD Inc, provider of analog and mixed-signal ASIC design, manufacturing and test services, announced its JurASIC Parts Program, a design service that focuses on bringing obsolete and non-linear audio (NLA) analog ICs back into production to meet the needs of older commercial and military applications. Read more

September 20, 2011 Fujitsu Semiconductor Limited has adopted Cadence signoff design-for-manufacturing (DFM) technologies for the company’s complex 28-nm ASIC and system-on-chip (SoC) mixed-signal designs. Deploying the Cadence DFM offerings is helping Fujitsu Semiconductor engineers ensure high yield, predictability, and a faster path to Silicon Realization for next-generation chips that will serve as the brains of the company’s advanced consumer electronics. Read more

August 31, 2011 Altis Semiconductor, a leading innovative European specialty foundry, is collaborating with Cadence Services to migrate and enhance various versions of its 130nm process design kits (PDK) supporting the latest release of Cadence Virtuoso custom IC design technology. Read more

July 18, 2011 Lattice Semiconductor Corporation has release 1.3 of its Lattice Diamond design software, the flagship design environment for Lattice FPGA products. Users of Lattice Diamond 1.3 software will benefit from major new features, including clock jitter analysis. Lattice Diamond 1.3 software is also now integrated with Lattice's PAC-Designer 6.1 mixed signal design tools which provide design support for Lattice's programmable mixed signal Platform Manager devices. Read more

July 18, 2011 Lattice Semiconductor Corporation has released 6.1 of its PAC-Designer mixed signal design software, with updated support for Lattice's Platform Manager, Power Manager II and ispClock devices. Users designing with Platform Manager devices will now have access to the Lattice Diamond 1.3 software design environment. Read more

July 12, 2011 austriamicrosystems' Full Service Foundry is to collaborate with F-Brain Co., Ltd to serve Japanese foundry customers on backend test solutions developed for the advanced LTX-Credence X-Series test platform. Read more

July 7, 2011 Chip vendor Microsemi Corp., has acquired privately-held mixed-signal IC vendor ASIC Advantage Inc. Terms of the acquisition were not disclosed. Read more

July 6, 2011 NXP Semiconductors has completed the company's agreement with Dover Corporation whereby Dover’s Knowles Electronics business has acquired NXP’s Sound Solutions business, initially announced on December 22, 2010. Under the terms of the agreement, Knowles has acquired NXP’s Sound Solutions business for $855 million in cash Read more

June 22, 2011 iWatt, Inc., has expanded the company’s family of DC/DC LED backlight drivers with its iW7032 which can power up to 32 parallel strings of LEDs. Like the iW7040, which powers up to 64 parallel strings of LEDs, the iW7032 is a mixed-signal IC that features iWatt’s digital adaptive switching technology with integrated MOSFETs. Read more

June 13, 2011 Mobile mixed-signal intellectual property (IP), Mixel Inc., has achieved first time success with its MIPI M-PHY IP test chip silicon. Mixel's M-PHY IP supports both TYPE I and TYPE II operation, A and B data rates, and all current and future MIPI M-PHY use-cases, such as DigRF v4, UniPro 1.4, CSI-3, LLI, and JEDEC's UFS. Read more

June 9, 2011 Dassault Systčmes has launched of a new integration with Synopsys.  The ENOVIA DesignSync for Synopsys' Galaxy Custom Designer mixed-signal implementation solution is now integrating the design data management (DDM) capabilities of both ENOVIA DesignSync Data Manager and ENOVIA DesignSync Central within the Synopsys Custom Designer environment.  Read more

June 6, 2011 Fairchild Semiconductor is stepping up its efforts to address what the company claims is one of the most significant challenges facing audio applications in the mobile industry today – the need to meet consumer demand for multimedia mobile devices that offer smaller speakers, sound louder and better, while minimizing impact on battery life. Read more

June 3, 2011 Apache Design Solutions, a provider of innovative power analysis and optimization solutions that enable the design of power-efficient, high-performance, noise-immune ICs and electronic systems, has announced that TSMC has included Apache's RedHawk, Totem, Sentinel, and chip models - CPM for power and CTM for thermal - in its Reference Flow 12.0, and Analog/Mixed-Signal (AMS) Reference Flow 2.0, targeting TSMC 28 nm process. Read more

June 3, 2011 Mentor Graphics Corporation has announced that a collection of tools have been validated for inclusion in TSMC Analog/Mixed-signal Reference Flow 2.0 (AMS Reference Flow 2.0), providing design enablement for TSMC 28nm process technology. Areas of collaboration produced new capabilities to ensure device reliability, provide early access to design and verification data and deliver faster simulation results. Read more

June 3, 2011 Synopsys, Inc., has collaborated with TSMC to deliver Synopsys' custom design solution for TSMC's 28-nm Analog/Mixed-Signal (AMS) Reference Flow 2.0. Part of TSMC's comprehensive 28nm design infrastructure, the flow delivers new advanced automation capabilities to improve productivity and shorten the design cycle. The new capabilities include both parasitic-aware and Layout Dependent Effect (LDE)-aware design methodologies. Read more

May 27, 2011 Skyworks Solutions, Inc. , an innovator of high reliability analog and mixed signal semiconductors, has signed a definitive agreement to purchase Advanced Analogic Technologies Incorporated, an analog semiconductor company focused on enabling energy-efficient devices for consumer electronics, computing and communications markets. The acquisition expands Skyworks' portfolio with complementary analog semiconductor products including battery chargers, DC/DC converters, voltage regulators and LED drivers. Read more

May 23, 2011 International automotive supplier Continental has selected austriamicrosystems' ASIC chip set for automotive Laser-based obstacle recognition systems (LIDAR) which is now entering high volume production. Read more

April 20, 2011 NXP Semiconductors N.V., has founded the Automotive Centre of Excellence (ACE) in Pune in association with the International Institute of Information Technology (I2IT). Located at I2IT Pune Campus, this Center of Excellence will provide infrastructure and collaboration of the Industry and academia. Read more

April 7, 2011 Canadian high-speed data transmission chip and IP vendor Gennum Corp. said Wednesday (April 6) it acquired for $34 million in cash Nanotech Semiconductor Ltd., a fabless IC vendor specializing in mixed-signal ICs for fiber optic communications. Read more

April 1, 2011 Sidense has ported the company’s 180 nm OTP memory SLP product line to ONC18, ON Semiconductor’s 180 nm digital and mixed-signal technology platform. Read more

March 28, 2011 iWatt has adopted Magma Design Automation's Titan platform to improve analog design and layout productivity, and to automate difficult routing tasks including analog cell layouts and chip-level assembly. Read more

March 23, 2011 CERN, the European Organization for Nuclear Research, is relying on Cadence Services to create and maintain design environments for internal design teams as well as for design teams in a number of collaborating physics institutes throughout Europe and the United States. Read more

March 18, 2011 In this news analysis article EE Times Europe Analog's editor, Paul Buckley, learns more about the concept behind ADI's upgraded Circuits from the Lab reference circuit program by talking with Dan Ledger who is Analog Devices' Worldwide Tools & Web User Experience Manager and the Program manager for Circuits from the Lab. Read more

March 17, 2011 Rutronik Elektronische Bauelemente GmbH is intensifying the company’s cooperation in Europe with Intersil Corporation, one of the leading manufacturers of high-performance analog products. Read more

March 15, 2011 Analog Devices, Inc., is aiming to help engineers save weeks of research and design time by extending the company's Circuits from the Lab reference circuit program to address what the company claims is a growing challenge facing engineers worldwide who are being asked to design products more quickly, with fewer iterations and using an ever broadening range of technologies requiring analog, RF, power and mixed-signal expertise. Read more

March 14, 2011 Cadence Design Systems, Inc., has unveiled major enhancements to its Virtuoso-based custom/analog flow, which will boost productivity across the entire flow from initial design specification to final GDSII and for process nodes down to 20 nm. Read more

March 9, 2011 Microsemi Corporation has unveiled the company's new solar technology portfolio which include products for renewable energy applications include SmartFusion and IGLOO FPGAs; analog, mixed signal devices such as bypass diodes/switches, MOSFETs, FREDs and IGBTs; DC-DC converters, and pulse width modulation (PWM) modules. Read more

March 2, 2011 Microsemi Corporation has announced that open source U-Boot firmware and uClinux are now available on SmartFusion intelligent mixed signal FPGAs. The availability of Linux on SmartFusion devices provides a convenient design environment as well as an array of open-source projects offered as starting points when developing support for required hardware interfaces. Read more

March 2, 2011 Microsemi Corporation has expanded the industrial ecosystem for the company’s SmartFusion intelligent mixed signal FPGAs. The new ecosystem strengthens the current SmartFusion device ecosystem and includes further support by Microsemi partners. Read more

February 28, 2011 Chip design software provider, Magma Design Automation, and LFoundry, the customer-specific manufacturer of analog, mixed-signal and specialized technologies, have validated LFoundry’s interoperable process design kits (iPDKs) for use with the Titan Mixed-Signal Design Platform, Titan Acclerators and FineSim circuit simulator for 0.15-micron technology platforms. Read more

February 24, 2011 Agilent Technologies expanded its mixed-signal and digital-storage oscilloscope portfolio with 26 new models that comprise its next-generation InfiniiVision 2000 and 3000 X-Series. The Agilent InfiniiVision 2000 X- Series offers bandwidths from 70 MHz to 200 MHz and according to the manufacturer, boasts the fastest waveform update rate in its class for superior viewing of signal detail and capture of infrequent events. Read more

February 23, 2011 IMS CHIPS has adopted Cadence Silicon Realization technologies for its special mixed-signal gate array technology. IMS CHIPS plans to deploy Cadence end-to-end Virtuoso custom and Encounter digital technologies for its commercial research business in areas such as advanced silicon technology, customer-specific circuits, nanopatterning and image sensor technology. Read more

February 1, 2011 Toumaz launched the TZ1053 Telran, an ultra-low energy (ULE) radio for wireless sensor networks, remote controls, green energy solutions, smart meters, and environmental monitoring. Built on the company’s proprietary AM Mixed Signal technology, the sub-1GHz radio SoC offers 1V operation using a single button cell battery and consumes less than 3mW continuous use power consumption. Read more

February 1, 2011 Cadence Design Systems, Inc. is advancing the design of giga-gate/gigahertz system on chips (SoCs) with a proven digital end-to-end flow at 28 nanometers that yields both performance and time-to-market advantages. Read more

January 24, 2011 Linear Technology Corporation has unveiled a dual output high efficiency synchronous step-down DC/DC controller with I2C-based PMBus interface for digital power system management. The LTC3880/-1 claims to combine best in class analog switching regulator performance with precision mixed signal data conversion for ease of power system design and management, supported by the LTpowerPlay software development system with easy-to-use graphical user interface (GUI). Read more

January 20, 2011 Hittite Microwave Corp. has acquired Arctic Silicon Devices, a developer of advanced mixed-signal integrated circuit (IC) technology, located in Trondheim, Norway. The acquisition price was approximately $12.0 million in cash and equity. Read more

January 19, 2011 There has been a major shift in the cell phone market, with smartphones gaining prominence over feature phones in the past few years. The paradigm shift in phones has created market opportunities for other consumer products, such as e-readers and tablet computers. Read more

January 19, 2011 ZMD AG (ZMDI), a global supplier of energy-efficient analog and mixed-signal solutions for automotive, industrial, consumer and medical applications, and SE Spezial-Electronic AG (SE), one of Europe's largest high-technology distributors, have signed a distribution agreement to sell ZMDI standard product ICs across an extended European region. Read more

December 31, 2010 As 2011 looms on the horizon why don't you while away the rest of 2010 by checking out the most popular analog and mixed-signal technical articles of 2010 that appeared in EE Times Europe Analog. Read more

December 23, 2010 Divestment of the Sound Solutions business marks a key step in NXP’s strategy to improve its capital structure and focus on High Performance Mixed Signal business growth Read more

December 20, 2010 Dialog Semiconductor plc, a provider of innovative power management semiconductor solutions, has won the 2010 Global Semiconductor Alliance (GSA) Outstanding EMEA Semiconductor Company Award. Read more

December 20, 2010 Analog and mixed-signal IP core provider Cosmic Circuits Pvt. Ltd. will develop foundation analog IP for Globalfoundries Inc. at the 55-, 40- and 28-nm nodes, according to the company. Read more

November 23, 2010 Analog IC design house, ICsense, and digital ASIC and FPGA design design house, Easics, are entering into partnership agreement which will pool their expertise to offer their customers high-quality, best-of-class mixed-signal ASIC applications. Read more

November 22, 2010 austriamicrosystems' Full Service Foundry business unit is expanding the company's fast and cost-efficient ASIC prototyping service, known as Multi-Project Wafer (MPW) or shuttle run, with a more extensive schedule in 2011. The service, which combines several designs from different customers onto one wafer offers cost benefits for foundry customers becuase the costs for wafer and masks are shared among a number of different shuttle participants. Read more

November 11, 2010 Fabless mixed-signal semiconductor company Elonics Ltd., based in Livingston, UK, has won the National Microelectronics Institute (NMI) Start Up of the Year Award. The Award recognises the importance to innovation and the long term potential to the economy that young companies possess. Judges assess applications based on success indicators that include the management team, technology, business model and market opportunity. Read more

November 10, 2010 Microsemi Corporation is making available Fusion mixed signal FPGAs with 100% temperature screening from -55 to +100 degrees C. The advancement enables the company to bring the mixed signal integration advantages of Fusion to the military, avionics, and defense industries, where highly reliable operation at extreme temperatures is needed. Read more

November 9, 2010 Shortlink AB and Landshut Silicon Foundry GmbH sign a partnership agreement to provide Shortlink low power RF and mixed-signal custom IP in LFoundry's industry leading LF150 modular 150 nm CMOS process technology. Read more

November 9, 2010 NXP Semiconductors N.V. has unveiled integrated, highly flexible driver IC solutions designed for vehicle LED headlights and tail lights, based on automotive-qualified technology. The ASL1010NTK and ASL1010PHN claim to be the industry’s first automotive LED driver ICs to integrate critical functionality such as direct LED temperature feedback, LED fault detection, internal PWM control for dimming, and short circuit protection – all on an automotive-qualified analog mixed-signal platform in an 8/16-pin package. Read more

November 5, 2010 Maxim Integrated Products has qualified and shipped production analog product built on 300 mm wafers in a technology development that gives Maxim a strategic edge in the analog/mixed-signal market. Read more

November 5, 2010 US-based analog mixed-signal ASIC design and test services company, JVD Inc., has expanded its sales operations internationally through a UK sales office based in Solihull in the West Midlands. The UK office will be managed by semiconductor veteran Nic Houslip, establishing the company’s first European local point of presence. Read more

October 28, 2010 Electronic components distributor Digi-Key Corporation is entering into an agreement with Exar Corporation to distribute the company’s analog and mixed-signal ICs to Digi-Key customers around the globe. Read more

October 21, 2010 Electronic components distributor Digi-Key Corporation is entering into an agreement with Exar Corporation to distribute Exar’s analog and mixed-signal ICs to Digi-Key customers around the globe. Read more

October 21, 2010 MaxLinear Inc. has what the company claims is the industry's first dual-tuner, quad demodulator digital cable front end chip with the ability to capture eight channels in a 200 MHz input frequency bandwidth located in the cable spectrum. Read more

October 12, 2010 Lattice Semiconductor Corporation has unveiled its third-generation mixed-signal devices, the Platform Manager family. The programmable Platform Manager devices aim to simplify board management design by integrating programmable analog and logic to support many common functions, such as power management, digital housekeeping and glue logic. Read more

September 21, 2010 Actel Corporation has unveiled new SmartFusion intelligent mixed signal FPGA reference designs targeting motor control applications. Read more

September 17, 2010 Actel is releasing the A2F500 Development Kit to take advantage of the highest density member of the company's SmartFusion intelligent mixed signal FPGA family. Read more

September 9, 2010 Sentinel IC Technologies, leading provider of design enablement platforms proven to optimize and shorten the analog, mixed-signal, RF, and power semiconductor design process, is opening of a European Technology Center in Delemont, Switzerland, just outside of Basel. Read more

August 19, 2010 Analog Devices has introduced 12-bit and 10-bit mixed-signal front-ends (MxFEs) that reduce power and board space for developers of wireless infrastructure and portable radio equipment. Read more

August 10, 2010 Analog Devices, Inc., has introduced a high-performance development platform for wireless infrastructure equipment designers who need to quickly evaluate systems using DPD (digital pre-distortion) techniques in multi-carrier cellular base stations.  Read more

August 4, 2010 Analog and mixed-signal semiconductors supplier, Semtech Corp., has joined forces with Microchip Technology Inc., a leading provider of microcontroller, analog and Flash-IP solutions, to release a reference design that provides a turnkey platform for highly secure, low-power, multi-band wireless remote keyless entry (RKE) systems. Read more

August 4, 2010 National Instruments has unveiled a new Ethernet-based NI CompactDAQ modular data acquisition system, which claims to combine the ease of use and low cost of a data logger with the performance and flexibility of modular instrumentation. Read more

August 3, 2010 Micrel, Inc., has introduced the KSZ8051/8031 family of ultra low-power, small package single-port 10/100 Physical Layer Transceivers. Read more

July 27, 2010 Analog Devices, Inc. has collaborated with industry leading programmable-logic vendor Xilinx Inc. to introduce a radio architecture development platform that helps multi-carrier cellular base station manufacturers reduce engineering resources and improve time to market. Read more

July 15, 2010 STMicroelectronics is standardizing on Cadence QRC Extraction to support its 40 nm custom/analog designs. QRC Extraction, which is a key component of the Cadence digital and analog/mixed signal design flow, enables faster turnaround time, scalability through its multi-core backplane, increased accuracy to silicon and capabilities to address the needs for advanced layout parasitic extraction in node design. Read more

July 8, 2010 High performance analog mixed-signal integrated circuits manufacturer, Microsemi Corporation, has introduced a compact, cost-effective four-port Power-over-Ethernet (PoE) midspan designed to power a wide range of network devices in low-density applications. Read more

June 30, 2010 The Global Semiconductor Alliance joined forces with the UK's Institution of Engineering and Technology to highlight and discuss European trends in semiconductor development and host a panel of European analog IC design experts at the GSA and IET International Semiconductor Forum in London. Read more

June 29, 2010 The Taiwan Semiconductor Manufacturing Company (TSMC) has incorporated Berkeley Design Automation's Analog FastSPICE unified circuit verification platform (AFS Platform) in the Analog Mixed Signal (AMS) Reference Flow 1.0 for device noise analysis. Read more

June 24, 2010 austriamicrosystems business unit Full Service Foundry is releasing its new analog/mixed signal high performance process design kit ("HIT-Kit") for its 0.18 µm High-Voltage CMOS technology H18. Read more

June 22, 2010 Actel is offering a power management solution for its newly introduced SmartFusion intelligent mixed signal FPGAs. Read more

June 15, 2010 X-FAB Silicon Foundries is now supporting Mentor's Olympus-SoC place and route system across X-FAB's wide range of advanced modular CMOS process technologies for digital and analog/mixed-signal (AMS) applications. Read more

June 15, 2010 ZMD AG, (ZMDI) a global supplier of analog and mixed-signal solutions for automotive, industrial, and medical applications, is entering entry into the LED market with the first three energy-efficient LED driver ICs of a new family. Read more

June 14, 2010 Post-layout verification specialist, EdXact's netlist reduction software Jivaro has been included in TSMC's Analog/Mixed-Signal Reference Flow for 28nm analog and mixed-signal circuit design. Read more

May 26, 2010 Peregrine Semiconductor Corporation, a supplier of high- performance RF CMOS and mixed-signal communications ICs, has introduce the new PE42451 SP5T (single pole five throw) RF switch. Read more

May 24, 2010 High-performance mixed-signal semiconductor solutions provider for the consumer electronics market, Wolfson Microelectronics plc, has selected SiliconGate a specialist supplier of power management IP for ASIC/SoC, to provide high-performance power management IP in a four-year contract. Read more

May 18, 2010 Magma Design Automation has qualified its Titan full-chip mixed-signal design, analysis and verification platform for TSMC's 40nm Interoperable Process Design Kit (iPDK). Read more

April 28, 2010 Silicon Laboratories Inc., has acquired Silicon Valley-based Silicon Clocks, an early stage company creating innovative microelectromechanical system (MEMS) technology. Read more

April 28, 2010 Wolfson Microelectronics plc and Tensilica, Inc., have inked a licence agreement to create a low power, high definition (HD) sound platform. Read more

April 28, 2010 High performance analog and mixed signal semiconductor manufacturer, Intersil Corporation, has completes the acquisition of Techwell, Inc, which designs and sells mixed signal video semiconductor solutions for the security surveillance and automotive infotainment markets. Read more

April 26, 2010 Aplix Corporation has introduced its picoJBlend platform for helping to develop Actel Corporation’s SmartFusion intelligent mixed signal FPGAs. Read more

April 22, 2010 Synopsys is making enhanced FPGA synthesis support available for Actel Corporation's new SmartFusion intelligent mixed signal FPGAs. Read more

April 22, 2010 Cadence Design Systems, Inc. has contributed new technology to the Accellera standards organization that can help engineers conduct faster and more thorough functional verification on complex mixed-signal SoCs. Read more

April 21, 2010 Landshut Silicon Foundry GmbH (LFoundry) and Tesat-Spacecom are collaborating to develop advanced, mixed-signal CMOS technology for space applications. Read more

April 19, 2010 Arrow Electronics, Inc., and Silicon Laboratories Inc., have agreed a global distribution agreement for Silicon Labs' broad portfolio of mixed-signal products. Read more

April 19, 2010 Keil is now supporting the Actel Corporation’s SmartFusion intelligent mixed signal FPGA family in the Keil MDK-ARM Microcontroller Development Kit. Read more

April 8, 2010 NXP Semiconductors has introduced its latest UHF solutions for the fashion, retail and electronics markets. Read more

March 29, 2010 Pigeon Point Systems (PPS), an Actel company, has unveiled a new Module Management Controller (MMC) Board Management Reference (BMR) Starter Kit based on Actel's SmartFusion intelligent mixed signal FPGAs. Read more

March 29, 2010 Mixed signal semiconductor solutions provider, Integrated Device Technology, Inc. (IDT), has added the newest members of its IDT VersaClock family of timing devices. Read more

March 26, 2010 Mixed signal semiconductor solutions provider, Integrated Device Technology, Inc., (IDT) is to work on a joint development program with Samplify Systems, a provider of signal compression technology, semiconductors, and solutions. Read more

March 26, 2010 MoSys, a provider of differentiated, high-density memory and high-speed interface (I/O) intellectual property (IP), has acquired MagnaLynx Inc. a developer of high-speed, low-power serial chip-to-chip communications technology. Read more

March 26, 2010 A FlexRay serial bus analysis function is now available as an option to 4-channel models in the Yokogawa DLM2000 Series of mixed-signal oscilloscopes. Designed to provide physical-layer waveform observation and protocol analysis for the fast, highly reliable FlexRay in-vehicle local area network, the new facility allows the user to capture FlexRay bus signals with a wide variety of dedicated triggers and carry out analysis and troubleshooting on parameters that can affect the FlexRay signal. Read more

March 11, 2010 Peregrine Semiconductor Corporation (San Diego, CA, USA), the supplier of high-performance RF CMOS and mixed-signal communications integrated circuits (ICs), is expanding its European design and manufacturing operations and the opening of a new facility located in Aix-en-Provence, France. Read more

March 8, 2010 Micrium has ported its uC/OS-II and uC/OS-III kernels and uC/TCP-IP stack to Actel's new SmartFusion intelligent mixed-signal FPGA. Read more

March 8, 2010 The Open SystemC Initiative (OSCI), an independent non-profit organization dedicated to supporting and advancing SystemC as an industry-standard language for electronic system-level (ESL) design, has released the SystemC Analog/Mixed-signal (AMS) extensions language standard, AMS 1.0. Read more

March 8, 2010 Landshut Silicon Foundry GmbH (LFoundry) has selected semiconductor intellectual property solutions provider, ChipStart Inc for foundry services representation. Read more

March 3, 2010 Silicon Laboratories Inc., is bringing the benefits of digital performance and integration to mechanically tuned analog radios with the introduction of the Si4830 AM/FM receiver. Read more

March 2, 2010 Actel Corporation has released an easy-to-use development environment for the newly introduced SmartFusion intelligent mixed signal FPGAs. Read more

March 2, 2010 Analog/mixed signal silicon foundry, LFoundry GmbH has announced that the German company's proposed acquisition of Atmel's wafer fabrication operation in Rousset, France, has been approved by employees at the facility and the Rousset Works Council. Read more

March 2, 2010 ZMDI (Dresden, Germany), a global supplier of analog and mixed-signal solutions for automotive, industrial, and medical applications,has introduced the ZSSC3053, a pure differential sensor signal conditioner (SSC) for high-accuracy amplification and sensor-specific correction of millivolt-level DC sensor signals. Read more

February 24, 2010 Belgian EDA tool innovator, Mephisto Design Automation (MDA) has unveiled its M-DESIGN 3.2 release which offers analog and mixed-signal designers immediate productivity gains for their front-end design tasks. Read more

February 16, 2010 Mixel Inc., a leader in mobile mixed-signal Intellectual Property (IP), is collaborating with Graphin Co., Ltd., an image sensor evaluation product developer , to allow Graphin to license the Mixel M-PHY IP to produce a “Golden M-PHY” IC for use in Graphin’s evaluation systems. Read more

February 6, 2010 Converters are key to mixed-signal products; here's a perspective on where they are headed in terms of performance, power, and functionality from James Caffrey and Rob Reeder, Analog Devices, Inc Read more