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Wolfson to move integrated MEMS microphones to 8in wafers May 20, 2013 Wolfson to move integrated MEMS microphones to 8in wafers Wolfson Microelectronics is integrating digital signal processing on the same die as its MEMS microphones and moving production to 8in (200mm) wafers in the first to make the move. Read more Virtex 7-based FPGA module for multi-FPGA SOC prototyping May 20, 2013 Virtex 7-based FPGA module for multi-FPGA SOC prototyping Pro Design is to introduce the "proFPGA V7 Mini FPGA Module", a cost-efficient FPGA module offering highest interface performance, to its family of FPGA based prototyping solutions. Read more Ultra-low-power SoC supports world's smallest Bluetooth location stickers May 16, 2013  Ultra-low-power SoC supports world's smallest Bluetooth location stickers Nordic Semiconductor ASA's nRF51822 SoC has been specified into the world's smallest Bluetooth low energy coin-sized location stickers. Read more Redux Labs spins out from HiWave to develop new haptics and embedded audio May 15, 2013 Redux Labs spins out from HiWave to develop new haptics and embedded audio Led by HiWave's former CEO and CTO, James Lewis and Chris Travis, start-up Redux Labs has been spun out to advance its Surface Sensation technology for third generation haptic and embedded audio technology. Read more New generation of thermal sensor arrays overcome the limitations in single-element sensors May 15, 2013 New generation of thermal sensor arrays overcome the limitations in single-element sensors ULIS is concluding the first of two phases in the MIRTIC (Micro Retina Thermal Infrared) project with the launch of the Micro80P thermal sensor array. Read more ETSI publishes first specification for Ultra Low Energy DECT aimed at the M2M market May 14, 2013 ETSI publishes first specification for Ultra Low Energy DECT aimed at the M2M market ETSI has published the first Technical Specification (TS 102 939-1) on DECT ULE (Ultra Low Energy), a low power consumption radio technology intended for home automation and other Machine-to-Machine (M2M) applications. Read more MEMS-based micro mirror laser projector can be integrated into cell phones May 14, 2013 MEMS-based micro mirror laser projector can be integrated into cell phones For years, Fraunhofer IPMS has been working on scanning mirrors for light deflection in one and two dimensions. Alongside resonant scanners with constant sinusoidal movement, a quasi-static variation has also been available for a while, which serves to make linear movement or static orientation in a ... Read more Advanced microcontroller combines floating point and low leakage technology May 13, 2013 Advanced microcontroller combines floating point and low leakage technology Energy Micro has begun shipping the company’s most advanced microcontroller yet, the EFM32 Wonder Gecko, with devices and development kits available immediately. Read more ‘Sentrollers’ taking over from ‘People’ as the majority population on the Internet, says GreenPeak Technologies May 13, 2013 ‘Sentrollers’ taking over from ‘People’ as the majority population on the Internet, says GreenPeak Technologies GreenPeak Technologies has released a white paper called “Sentrollers and the Internet of Things” where it defines Sentrollers as a new, all-encompassing term for sensors, actuators and controllers – the various devices that make up the new Internet of Things. Read more Piezoelectric taxels made up of zinc oxide nanowires convert motion to electronic signals May 13, 2013 Piezoelectric taxels made up of zinc oxide nanowires convert motion to electronic signals Using bundles of vertical zinc oxide nanowires, researchers of the Georgia Institute of Technology have fabricated arrays of piezotronic transistors capable of converting mechanical motion directly into electronic controlling signals. Read more
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