News
OMAP5432 processor-based EVM boosts graphics capabilities for industrial applications May 21, 2013
Texas Instruments Incorporated has introduced the company's OMAP5432 processor-based evaluation module (EVM) for high-performance industrial applications to help developers jumpstart their product designs.
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DMA reference design is released for Stratix V and PCIe Gen3 solutions
May 21, 2013
Altera Corporation's 28 nm Stratix V GX FPGAs have achieved inclusion on the latest PCI-SIG Integrators List for the PCI Express (PCIe) 3.0 specification (Gen3).
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EnSilica partners Cross Border Technologies to boost sales growth in key European markets
May 21, 2013
EnSilica has partnered with Cross Border Technologies to accelerate the sales of EnSilica's IC design services and system IP solutions in key European and Asian markets, particularly Germany, France, Japan and Korea.
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Industry's first ultra-wideband Doherty amplifiers support broadband operation
May 21, 2013
NXP Semiconductors N.V. has introduced an ultra-wideband Doherty reference design using the BLF884P and BLF884PS – the industry’s first wideband Doherty power amplifiers capable of broadband operation (470 to 806 MHz).
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Graphics chip recognizes nearby pedestrians and bicycles
May 21, 2013
Fujitsu Semiconductor Europe (FSEU) announced the development of MB86R24, the company's third-generation graphic SoCs for automotive applications. The device incorporates the Approaching Object Detection functionality - which notifies drivers of nearby people, bicycles and other objects - into the 36 ...
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Family of modules provides all-in-one LTE connectivity for M2M
May 21, 2013
French 4G chipmaker Sequans Communications has introduced a new line of LTE modules with a complete RF front end and key interfaces in a single, compact package for M2M designs.
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World's lowest power Bluetooth smart chip is unveiled
May 21, 2013
Dialog Semiconductor plc launches SmartBond, which claims to be the world’s lowest power and smallest Bluetooth Smart System-on-Chip that more than doubles the battery life of an app-enabled smartphone accessory or computer peripheral compared with competing solutions on the market.
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Places2Be project aims to boost European leadership around FD-SOI
May 21, 2013
A group of 19 leading European companies and academic institutions have launched Places2Be, a 3-year, €360 million advanced-technology pilot-line project to support the industrialization of Fully-Depleted Silicon-On-Insulator (FD-SOI) microelectronics technology.
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Industrial USB camera delivers 2592x1944 pixels at 15fps in a 23x26.5x21.5mm casing
May 21, 2013
With the XS, IDS is launching a generation of cameras that combines the convenient operation of a standard consumer camera, along with the versatility of a robust industrial camera. The 23x26.5x21.5mm unit weighs just 12 grams and can be integrated very easily into any system. Its magnesium housing makes ...
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Rogers to show advanced circuit materials at IMS 2013
May 21, 2013
Rogers Corporation will highlight several of its high quality printed circuit board (PCB) materials at the upcoming 2013 IEEE International Microwave Symposium (IMS). In addition, John Coonrod, Rogers Market Development Engineer, will be presenting “Determining Circuit Material Dielectric Constant from ...
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