News
New products
USB 2.0 hub controller chip enables rapid charging via a single USB connector May 22, 2013
Renesas Electronics has developed the µPD720115 USB 2.0 hub controller chip, which supports simultaneous USB communication and charging of portable devices such as smartphones and tablet PCs via a single USB connector.
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High-voltage IGBT gate drivers speed ASIL C/D designs for HEV subsystems
May 22, 2013
Infineon Technologies AG has introduced the company's next generation of high-voltage IGBT gate drivers.
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Digital and analog I/O modules have built-in web servers
May 22, 2013
Audon Electronics' ControlByWeb family comprises a set of DIN rail mounting digital and analog I/O modules with built-in web servers. This allows their remote monitoring and control across the Web or any other IP network using a standard web browser on a computer, tablet or smartphone.
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OMAP5432 processor-based EVM boosts graphics capabilities for industrial applications
May 21, 2013
Texas Instruments Incorporated has introduced the company's OMAP5432 processor-based evaluation module (EVM) for high-performance industrial applications to help developers jumpstart their product designs.
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Family of modules provides all-in-one LTE connectivity for M2M
May 21, 2013
French 4G chipmaker Sequans Communications has introduced a new line of LTE modules with a complete RF front end and key interfaces in a single, compact package for M2M designs.
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World's lowest power Bluetooth smart chip is unveiled
May 21, 2013
Dialog Semiconductor plc launches SmartBond, which claims to be the world’s lowest power and smallest Bluetooth Smart System-on-Chip that more than doubles the battery life of an app-enabled smartphone accessory or computer peripheral compared with competing solutions on the market.
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Industrial USB camera delivers 2592x1944 pixels at 15fps in a 23x26.5x21.5mm casing
May 21, 2013
With the XS, IDS is launching a generation of cameras that combines the convenient operation of a standard consumer camera, along with the versatility of a robust industrial camera. The 23x26.5x21.5mm unit weighs just 12 grams and can be integrated very easily into any system. Its magnesium housing makes ...
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Rogers to show advanced circuit materials at IMS 2013
May 21, 2013
Rogers Corporation will highlight several of its high quality printed circuit board (PCB) materials at the upcoming 2013 IEEE International Microwave Symposium (IMS). In addition, John Coonrod, Rogers Market Development Engineer, will be presenting “Determining Circuit Material Dielectric Constant from ...
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EDA environment for the analysis of on chip passive devices
May 21, 2013
Sonnet Software has announced, Blink™, an easy-to-use EDA environment for the analysis of on chip passive devices such as spiral inductors and MIM capacitors. Blink will be available to the market in late 2013.
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Cadence launches massively parallel timing tool to speed SoC design
May 20, 2013
Cadence Design Systems has launched a new static timing analysis and closure tool designed to run on passively parallel hardware and enable System-on-Chip (SoC) developers to speed timing closure and move chip designs to fabrication quickly.
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Technical papers
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